In high-temperature metal joining processes (welding, brazing and
soldering), the primary purpose of flux is to prevent oxidation of the
base and filler materials. Tin-lead solder (e.g.) attaches very well to
copper, but poorly to the various oxides of copper, which form quickly
at soldering temperatures. Flux is a substance which is nearly inert at
room temperature, but which becomes strongly reducing
at elevated temperatures, preventing the formation of metal oxides.
Additionally, flux allows solder to flow easily on the working piece
rather than forming beads as it would otherwise